Carlos H. Diaz at the Wilson Lecture Series
Nanoelectronics and VLSI
The quest for sustainable growth in computing performance and expanded functional capabilities of information technology and communication (ICT) products requires significant improvements in the energy-efficiency from the underlying technologies to the systems, architectures, algorithms, software layers. Fundamental changes in the information representation and processing may also be necessary to enable higher cognitive capabilities in artificial intelligence with the necessary energy-efficiency for widespread use. In this talk I will discuss challenges and research opportunities pertaining emerging transistors, memories, and 3D interconnect fabrics while also addressing the necessary completeness of the metrics to be met in order for the results of those research to become viable alternatives to state-of-the art technologies and their projected evolutionary paths. I will also briefly talk about hyper-dimensional information representation and processing for AI applications.
About the speaker
Carlos H. Diaz earned his bachelor’s degrees in electrical engineering and physics and his master’s degree in electrical engineering from Universidad de Los Andes, Bogota, Colombia. He holds a Ph.D. in electrical engineering from University of Illinois at Urbana-Champaign. He is Senior Director in Research and Development, Taiwan Semiconductor Manufacturing Company. He has published over 100 technical papers, holds over 200 US patents, and has published one book. Dr. Diaz was elected an IEEE Fellow in 2008 for his contributions to deep-submicron foundry technology. In 2011, he was co-recipient of the Annual Innovation Breakthrough Award, Ministry of Economic Affairs, Taiwan R.O.C., conferred to TSMC's 28nm logic technology. He was the recipient of the 2016 IEEE Andrew Grove Award for sustained contributions to and leadership in foundry advanced CMOS logic transistor technology. He received the Distinguished Alumni Award in Electrical and Computer Engineering, University of Illinois at Urbana-Champaign in 2018.