Dicing Saw
Type: Other
Description: Used to cut substrates made of silicon, glass, Pyrex, and sapphire.
Substrate Compatibility: Varying sizs allowed, from pieces, all the way up to 4 inch wafers (1mm thick).
Location: Keller-Area 1
Badger Name: K4C Dicing Saw DAC 552
Supplemental Material: Wafer Dicing: A Beginners Guide
Training: Review SOP prior to requesting training.
