Type: Other

Description: Wire bonding is the method of  interconnecting between device to device, device to package,  or device to printed circuit board. Wire bonding is generally considered the lowest cost and flexible interconnect method used in the semiconductor industry. The West bond wire bonder can be used for Thermosonic or  Ultrasonic bonding.

Location: PAN-Bay 2

Badger Name: P2 Wirebonder 7476D Westbond

Training: Review the SOP prior to requesting training.