Description: Wire bonding is the method of interconnecting between device to device, device to package, or device to printed circuit board. Wire bonding is generally considered the lowest cost and flexible interconnect method used in the semiconductor industry. The West bond wire bonder can be used for Thermosonic or Ultrasonic bonding.
Location: PAN-Bay 2
Badger Name: P2 Wirebonder 7476D Westbond