AV1 Etcher-PAN

Type: Etcher

Description: Reactive ion etching system using fluorine based gases to etch oxides, silicon, nitrides, resist, and polyimide. Using methanol vapors, magnetic materials (Co, Fe, Ni, etc) can also be etched.

Substrate Compatibility: Varying sizes allowed, from pieces, all the way up to 6 inch wafers.

Location: PAN-Bay 2

Badger Name: P2 Etcher AV-1 Plasmatherm

Supplemental Material: RatesProcess recipe parameters

Training: Review the SOP prior to requesting training.