ALD (Atomic Layer Deposition) KJ Lesker - Thermal
Description: The KJL ALD-150LE is a thermal Atomic Layer Deposition (ALD) system configured for use with up to 150mm diameter or smaller planar substrates. Substrate thickness is limited is 1.9mm or lower. This ALD tool deposits thin films layers a cycle at a time by dosing a single precursor at a time followed by a purge
Films: alumina (Al2O3), hafnium oxide (HfO2), titanium dioxide (TiO2), and zirconium dioxide (ZrO2).
Substrate Compatibility: Varying sizes allowed, from pieces, all the way up to 6-inch wafers.
Location: PAN 3
Badger Name: P3 ALD KJL