AJA1 Sputterer - Keller
Type: Deposition-PVD
Description: The AJA sputter system utilizes ionized gas plasma (Ar, O2, N2) to sputter metal and dielectric material from source targets to substrates, depositing a thin film in the process. There are 4 shuttered guns on the system: 2 DC, and 2 RF.
Films: Al, Al/Si(2%), Al2O3, Au, Cr, Cu, Ge, ITO, Mo, Ni, Pt, Si3N4, SiO2, Ta, Ti, TiO2, W, etc.
Substrate Compatibility: Varying sizes allowed, from pieces, all the way up to 6 inch wafers.
Location: Keller-Bay 3
Badger Name: K3 Sputterer AJA1
Supplemental Material: Deposition Rates, ITO Summary, Available Sputtering Targets
Training: Watch the training video and review the SOP prior to requesting training.
