AV2 Etcher-Keller
Type: Etcher
Description: Reactive ion etching system uses fluorine based gases to etch oxides, silicon, nitrides, resist, and polyimide. No metal masks allowed.
Substrate Compatibility: Varying sizes allowed, from pieces, all the way up to 8 inch wafers.
Location: Keller-Bay 3
Badger Name: K3 Etcher AV-2 Plasmatherm
Training: Review the SOP prior to requesting training.
