Oxford Etcher

Type: Etcher

Description: Reactive ion etching system with Fl and Cl gases, inductively coupled plasma (ICP), and a load lock. Compatible with normal semiconductor materials such as oxides, silicon, nitride, resists, metals, III-V material, and polymides.

Substrate Compatibility: 4 inch wafers only. Pieces can be used if placed on a 4 inch carrier wafer. 

Location: PAN-Bay 2

Badger Name: P2 Etcher Oxford

Supplemental Material: Oxford etch chart

Training: Review SOP prior to requesting training.