Harrick Plasma Etcher

Type: Etcher

Description:  Uses oxygen or argon plasma to chemically remove photoresist and other organic compounds from the surface of substrates. Can also be used for surface activation of various kinds of research samples and wafers prior to downstream chemical functionalization.

Substrate Compatibility: Varying sizes allowed, from pieces, all the way up to 6 inch wafers.

Location: PAN-Bay 4

Badger Name: P4 Harrick Plasma Etcher

Training: Review the SOP prior to requesting training.