Asher-Oxygen Etcher

Type: Etcher

Description: Uses oxygen plasma to chemically remove photoresist and other organic compounds from the surface of substrates. Barrel etcher that provides a non-directional plasma (isotropic etch).

Substrate Compatibility: Varying sizes allowed, from pieces, all the way up to 6 inch wafers.

Location: Keller-Bay 2

Badger Name: K2 Etcher Asher

Training: A general photolithography short course will include training on this tool. Review the SOP prior to requesting training.