Asher-Oxygen Etcher
Type: Etcher
Description: Uses oxygen plasma to chemically remove photoresist and other organic compounds from the surface of substrates. Barrel etcher that provides a non-directional plasma (isotropic etch).
Substrate Compatibility: Varying sizes allowed, from pieces, all the way up to 6 inch wafers.
Location: Keller-Bay 2
Badger Name: K2 Etcher Asher
Training: A general photolithography short course will include training on this tool. Review the SOP prior to requesting training.
