FilmSense-Film Thickness
Type: Characterization
Description: A non-destructive method of measuring the index of refraction and film thickness of a dielectric film on a reflecting substrate. Has automated stage and wafer mapping. Can measure film thickness as low as a few Å and up to 3 µm.
Substrate Compatibility: Varying sizes allowed, from pieces, all the way up to 8 inch wafers.
Location: PAN-Bay 2
Badger Name: P2 Ellipsometer FilmSense
Training: Review SOP prior to requesting training.
