Film Stress Measurement (FSM)

Type: Characterization

Description: Used to measure film stress at room temperature or elevated temperatures. Also measures Wafer Bow Height and, with well characterized substrates, the film's modulus and its coefficient of thermal expansion.

Substrate Compatibility: 4 inch wafers, up to 8 inch.

Location: Keller-Bay 1

Badger Name: K1 Film Stress FSM 900

Supplemental Material: Stress Calculation SpreadsheetHeat Cycle SpreadsheetHeat RM Temp Spreadsheet

Training: Review SOP prior to requesting training.