Film Stress Measurement (FSM)
Type: Characterization
Description: Used to measure film stress at room temperature or elevated temperatures. Also measures Wafer Bow Height and, with well characterized substrates, the film's modulus and its coefficient of thermal expansion.
Substrate Compatibility: 4 inch wafers, up to 8 inch.
Location: Keller-Bay 1
Badger Name: K1 Film Stress FSM 900
Supplemental Material: Stress Calculation Spreadsheet, Heat Cycle Spreadsheet, Heat RM Temp Spreadsheet
Training: Review SOP prior to requesting training.
