Wafer Bonder
Type: Other
Description: Used for wafer bonding. Capable of silicon fusion, anodic, and eutectic bonding.
Substrate Compatibility: 4 inch wafers only. When approved by staff, pieces can be used if placed on a 4 inch carrier wafer.
Location: Keller-Bay 1
Badger Name: K1 Wafer Bonder SB6 Karl Suss
Supplemental Material: Process Notes
Training: Review the SOP prior to requesting training.
