Wafer Bonder

Type: Other

Description: Used for wafer bonding. Capable of silicon fusion, anodic, and eutectic bonding.

Substrate Compatibility: 4 inch wafers only. When approved by staff, pieces can be used if placed on a 4 inch carrier wafer.

Location: Keller-Bay 1

Badger Name: K1 Wafer Bonder SB6 Karl Suss

Supplemental Material: Process Notes

Training: Review the SOP prior to requesting training.